Why Use
Lasers?
(1) Material Selective
- Wavelength
can be absorbed selectively
- Localized
thermal effects controlled (low) thermal budget
- Non-contact
processes less expensive consumables
- Light can
be focused within or through transparent materials at interfaces between
materials to mark, ablate, lift-off or weaken (used in thin film solar, stealth
dicing, glass cutting, flap cutting, laser lift off)
(2) High Precision
- UV laser
light can be tightly focused to create very small feature sizes with resolution
down to micrometers or less
- Ultra short
pulses with high peak intensities can be used to ablate material/features that
cannot be cut with any blade/drill
- Feature
depth control on nanometer scale
- Light
scattering can be used to detect nm features or defects
(3) Scalability / Productivity
/ Lower Costs
- High
throughput laser processes reduce costs
- Large
substrates (e.g. G8~G10 glass)
- Fewer process
steps
- Eco-Friendly
= No Wet Chemistry
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